Samsung Electronics Signs MOU With AMD To Expand Strategic Collaboration On Next-Gen AI Memory And Computing Technologies

Samsung Electronics has signed a Memorandum of Understanding (MOU) with AMD to enhance their collaboration on next-generation AI memory and computing technologies. The partnership will focus on supplying industry-leading HBM4 for AMD Instinct™ MI455X GPUs and DDR5 solutions for AMD EPYC™ processors and the AMD Helios platform. The signing ceremony took place at Samsung's advanced chip manufacturing complex in Pyeongtaek, Korea, with key executives from both companies in attendance.