GlobalFoundries Reaches Deal With TSMC To Create U.S.-Based Supply Of Silicon Interposers For TSMC's CoWoS Advanced Packaging Ecosystem

GlobalFoundries (GFS) has entered into a manufacturing agreement with TSMC to create a U.S.-based supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem. This deal will involve expanding fabrication capacity at GlobalFoundries' Malta, New York facility to meet the increasing demand for high-performance computing and AI systems. The agreement also sets the stage for future capacity expansion as customer demand rises.