UMC and AP Memory Announce Technology Collaboration for AI and HPC Power Solutions

United Microelectronics Corporation (UMC) and AP Memory have formed a technology collaboration focused on enhancing power efficiency in AI and high-performance computing (HPC) data centers. The partnership utilizes UMC's deep trench capacitor foundry technology and AP Memory's silicon capacitor designs, achieving a significant milestone in Q3 2026 with the successful tape-out and validation of AP Memory's S-SiCap™ Gen2D capacitors. The companies are set to conduct further performance testing and are considering additional collaborative projects involving capacitor-embedded interposers.